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| INTEGRATED CIRCUITS DATA SHEET TEA1211HN High efficiency auto-up/down DC/DC converter Preliminary specification Supersedes data of 2003 Aug 06 2003 Oct 13 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.12.1 7.12.2 7.12.3 7.12.4 7.13 7.13.1 7.13.2 7.13.3 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Introduction Control mechanism PWM PFM Switching sequence Adjustable output voltage Start-up Under voltage lockout Shut-down Power switches Synchronous rectification PWM-only mode External synchronisation Current limiter I2C-bus serial interface Characteristics of the I2C-bus START and STOP conditions Bit transfer Acknowledge I2C-bus protocol Addressing Data Write Cycle 8 9 10 11 11.1 11.2 11.2.1 11.2.2 11.2.3 11.2.4 11.2.5 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 LIMITING VALUES TEA1211HN THERMAL CHARACTERISTICS CHARACTERISTICS APPLICATION INFORMATION Typical Li-Ion, 2- or 3-cell application with I2C-bus programming Component selection Inductor Capacitors Schottky diodes Feedback resistors Current Limiter PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS 2003 Oct 13 2 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 1 * FEATURES I2C-bus programmable output voltage range of 1.5 V to 5.5 V TEA1211HN * Single inductor topology * High efficiency up to 94 % over wide load range * Wide input range; functional from 2.55 V up to 5.5 V * 1.7 A maximum input and output current * Low quiescent power consumption * 600 kHz switching frequency * Four integrated very low RDS(on) power MOSFETs * Synchronizable to external clock * Externally adjustable current limit for protection and efficient battery use in case of dynamic loads * Under voltage lockout * PWM-only option * Shut-down current less than 1 A * 32-pin small body HVQFN package. 2 APPLICATIONS 3 GENERAL DESCRIPTION The TEA1211HN is a fully integrated auto-up/down DC/DC converter circuit with I2C-bus interface. Efficient, compact and dynamic power conversion is achieved using a digitally controlled pulse width and frequency modulation like control concept, four integrated low RDS(on) power switches with low parasitic capacitances and fully synchronous rectification. The combination of auto-up/down DC/DC conversion, high efficiency and low switching noise makes the TEA1211HN well suited to supply a power amplifier in a cellular phone. The output voltage can be I2C-bus programmed to the exact voltage needed to achieve a certain output power level with optimal system efficiency, thus enlarging battery lifetime. The TEA1211HN operates at 600 kHz switching frequency which enables the use of small size external components. The switching frequency can be locked to an external high frequency clock. Deadlock is prevented by an on-chip under voltage lockout circuit. An adjustable current limit enables efficient battery use even at high dynamic loads. Optionally, the device can be kept in pulse width modulation mode regardless of the load applied. * Stable output voltage from Lithium-Ion batteries * Variable voltage source for PAs (Power Amplifiers) in cellular phones * Wireless handsets * Hand-held instruments * Portable computers. 4 ORDERING INFORMATION TYPE NUMBER PACKAGE NAME HVQFN32 DESCRIPTION plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm VERSION SOT617-3 TEA1211HN 2003 Oct 13 3 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 5 BLOCK DIAGRAM n.c. 6, 8, 17, 19 2, 31, 32 IN LXA 1, 3, 4, 10, 11 LXB 14, 15, 21, 22, 24 TEA1211HN handbook, full pagewidth TEA1211HN P-type power FET P-down P-type power FET P-up 23, 25, 26 OUT INTERNAL SUPPLY sense FET N-down N-type power FETs N-up TEMPERATURE PROTECTION DIGITAL CONTROLLER 27 13 MHz OSCILLATOR Window comparator FB CLOCK SELECTOR I2C-BUS INTERFACE Current limit comparator BANDGAP REFERENCE 29 SYNC/PWM 28 SHDWN 12 SCL 13 SDA 30 ILIM 5, 7, 9, 16, 18, 20 MDB001 GND Fig.1 Block diagram. 6 PINNING SYMBOL PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION inductor connection 1 input voltage inductor connection 1 inductor connection 1 ground not connected ground not connected ground inductor connection 1 inductor connection 1 serial clock input line I2C-bus serial data input/output line I2C-bus inductor connection 2 inductor connection 2 ground 4 SYMBOL n.c. GND n.c. GND LXB LXB OUT LXB OUT OUT FB SHDWN SYNC/PWM ILIM IN IN PIN 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 ground DESCRIPTION not connected not connected ground inductor connection 2 inductor connection 2 output voltage inductor connection 2 output voltage output voltage feedback input shut-down input synchronization clock input, PWM-only input current limit resistor connection input voltage input voltage LXA IN LXA LXA GND n.c. GND n.c. GND LXA LXA SCL SDA LXB LXB GND 2003 Oct 13 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN 9 GND 13 SDA 12 SCL handbook, halfpage n.c. 8 GND 7 n.c. 6 GND 5 LXA 4 LXA 3 IN 2 LXA 1 IN 31 ILIM 30 SHDWN 28 FB 27 OUT 26 SYNC/PWM 29 OUT 25 IN 32 16 GND 17 n.c. 18 GND 19 n.c. 20 GND 21 LXB 22 LXB 23 OUT 24 LXB MDB002 10 LXA 11 LXA 14 LXB TEA1211HN This diagram is a bottom side view. Pin 1 is indicated with a dot on the top side of the package. For mechanical details of HVQFN32 package, see Chapter 12. Fig.2 Pin configuration. 7 7.1 FUNCTIONAL DESCRIPTION Introduction The TEA1211HN is able to operate in Pulse Frequency Modulation (PFM) or discontinuous conduction mode as well as in Pulse Width Modulation (PWM) or continuous conduction mode. All switching actions are completely determined by a digital control circuit which uses the output voltage level as control input. This digital approach enables the use of a new pulse width and frequency modulation scheme, which ensures optimum power efficiency over the complete range of operation of the converter. 7.2 Control mechanism handbook, halfpage Icoil 15 LXB PWM PFM 0 VIN > VOUT down mode Depending on load current Iload and VIN to VOUT ratio, the controller chooses a mode of operation. When high output power is requested, the device will operate in PWM (continuous conduction) mode, which is a 2-phase cycle in up- as well as in down mode. For small load currents the controller will switch over to PFM (discontinuous mode), which is either a 3- or 4-phase cycle depending on the input to output ratio, see Fig.3. VIN = VOUT stationary mode VIN < VOUT up mode MDB003 Fig.3 Waveform of coil current as function of Iload and VIN to VOUT ratio. 2003 Oct 13 5 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 7.2.1 PWM TEA1211HN normal PWM control can continue. The output voltage (including ESR effect) is again within the predefined window. Figure 5 depicts the spread of the output voltage window. The absolute value is most dependent on spread, while the actual window size is not affected. For one specific device, the output voltage will not vary more than 2 % typically. 7.2.2 PFM PWM results in minimum AC currents in the circuit components and hence optimum efficiency, cost and EMC. In this mode the output voltage is allowed to vary between two predefined voltage levels. When the output voltage stays within this so called window, switching continues in a fixed pattern. When the output voltage reaches one of the window borders, the digital controller immediately reacts by adjusting the duty cycle and inserting a current step in such a way that the output voltage stays within the window with higher or lower current capability. This approach enables very fast reaction to load variations. Figure 4 shows the TEA1211HN's response to a sudden load increase in case of up conversion. The upper trace shows the output voltage. The ripple on top of the DC level is a result of the current in the output capacitor, which changes in sign twice per cycle, multiplied by the capacitor's internal Equivalent Series Resistance (ESR). After each ramp-down of the inductor current, or when the ESR effect increases the output voltage, the TEA1211HN determines what to do in the next cycle. As soon as more load current is taken from the output the output voltage starts to decay. When the output voltage becomes lower than the low limit of the window, corrective action is taken by a ramp-up of the inductor current during a much longer time. As a result, the DC current level is increased and In low output power situations, TEA1211HN will switch over to PFM mode operation in case PWM-only mode is not activated. In this mode charge is transferred from battery to output in single pulses with a wait phase in between. Regulation information from earlier PWM mode operation is used. This results in optimum inductor peak current levels in PFM mode, which are slightly larger than the inductor ripple current in PWM mode. As a result, the transition between PFM and PWM mode is optimal under all circumstances. In PFM mode, the TEA1211HN regulates the output voltage to the limits shown in Fig.5. Depending on the VIN to VOUT ratio the TEA1211HN decides for a 3- or 4-phase cycle, where the last phase is the wait phase. When the input voltage almost equals the output voltage, one of the slopes of a 3-phase cycle becomes weak. Then the charge, or the integral of its pulse, is near to zero and no charge is transferred. In this region the 4-phase cycle is used, (see Fig.3). handbook, full pagewidth load increase VOUT start corrective action high window limit low window limit time Iload time MDB004 Fig.4 Response to load increase in up-mode. 2003 Oct 13 6 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN handbook, full pagewidth maximum positive spread of VFB Vh 2% +4% Vh Vl upper specification limit VOUT (typ.) 2% Vl -4% typical situation Vh 2% Vl lower specification limit MDB005 maximum negative spread of VFB Vh = High window limit Vl = Low window limit Fig.5 Spread of location of output voltage window. 7.2.3 SWITCHING SEQUENCE 7.4 Start-up Refer to Figures 1 and 3. In up-mode the cycle starts by making P-down and N-up conducting in the first phase. The second phase N-up opens and P-up starts conducting. In down-mode the cycle starts with in the first phase P-up and P-down conducting. The second phase P-down opens and N-down starts conducting. In PFM these two phases are followed by a third or wait phase that opens all switches except for N-down, which is closed to prevent the coil from floating. The stationary mode or 4-phase cycle, which only occurs in PFM, starts with in the first phase P-down and N-up conducting. In the second phase P-down and P-up conduct forming a short-cut from battery to output capacitor. In the third phase P-up and N-down conduct. The fourth or wait-phase again opens all switches except for N-down which is closed to prevent the coil from floating. 7.3 Adjustable output voltage If the input voltage exceeds the start voltage, the TEA1211HN starts ramping up the voltage at the output capacitor. Ramping stops when the target level, set by the external resistors, is reached. 7.5 Under voltage lockout As a result of too high load or disconnection of the input power source, the input voltage can drop too low to guarantee normal regulation. In that case, the device switches to a shut-down mode stopping the switching completely. Start-up is possible by crossing the start-up level again. 7.6 Shut-down When pin SHDWN is made HIGH, the converter disables all switches except for N-down (see Fig.1) and power consumption is reduced to a few A. N-down is kept conducting to prevent the coil from floating. 7.7 Power switches The output voltage of the TEA1211HN can be set to a fixed value by means of an external resistive divider. After start-up through this divider, dynamic control of the output voltage is made possible by use of an I2C-bus. The output voltage can be programmed from 1.5 V to 5.5 V in 40 steps of 0.1 V each. In case of Power Amplifiers (PAs) for example the output voltage of the TEA1211HN can be adjusted to the output power to be transmitted by the PA, in order to obtain maximum system efficiency. 2003 Oct 13 7 The power switches in the IC are two N-type and two P-type MOSFETs, having a typical pin-to-pin resistance of 85 m. The maximum continuous input/output current in the switches is 1.7 A at 70 C ambient temperature. Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 7.8 Synchronous rectification TEA1211HN current limitation protects the IC against overload conditions, inductor saturation, etc. The current limit level is user defined by the external resistor which must be connected between pin ILIM and pin GND. 7.12 I2C-bus serial interface For optimal efficiency over the whole load range, synchronous rectifiers inside the TEA1211HN ensure that in PFM mode during the phase where the coil current is decreasing, all inductor current will flow through the low ohmic power MOSFETs. Special circuitry is included which detects that the inductor current reaches zero. Following this detection, the digital controller switches off the power MOSFET and proceeds regulation. Negative currents are thus prevented. 7.9 PWM-only mode The serial interface of the TEA1211HN is the I2C-bus. A detailed description of the I2C-bus specification, including applications, is given in the brochure: "The I2C-bus and how to use it", order no. 9398 393 40011. 7.12.1 CHARACTERISTICS OF THE I2C-BUS When pin SYNC/PWM is HIGH, the TEA1211HN will use PWM regulation independent of the load applied. As a result, the switching frequency does not vary over the whole load range. 7.10 External synchronisation If a high frequency clock is applied to pin SYNC/PWM, the switching frequency in PWM mode will be exactly that frequency divided by 22. PFM mode is not possible if an external clock is applied. The quiescent current of the device increases when an external clock is applied. In case no external synchronisation is necessary and the PWM-only option is not used, pin SYNC/PWM must be connected to ground. 7.11 Current limiter The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a Serial Data line (SDA) and a Serial Clock Line (SCL). Both lines must be connected to a positive supply via a pull-up resistor (for best efficiency it is advised to use the input voltage of the convertor). Data transfer may be initiated only when the bus is not busy. In bus configurations with ICs on different supply voltages, the pull-up resistors shall be connected to the highest supply voltage. The I2C-bus supports incremental addressing. This enables the system controller to read or write multiple registers in only one I2C-bus action. The TEA1211HN supports the I2C-bus up to 400 kbit/s. The I2C-bus system configuration is shown in Fig.6. A device generating a message is a transmitter, a device receiving a message is a receiver. The device that controls the message is the master and the devices which are controlled by the master are the slaves. The TEA1211HN is a slave only device. If the peak input current of the TEA1211HN exceeds its limit in PWM mode, current ramping is stopped immediately, and the next switching phase is entered. The SDA handbook, full pagewidth SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER MDB006 SLAVE RECEIVER MASTER TRANSMITTER Fig.6 I2C-bus system configuration. 2003 Oct 13 8 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 7.12.2 START AND STOP CONDITIONS TEA1211HN Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Fig.7). handbook, full pagewidth SDA SDA SCL S START condition P STOP condition SCL MDB007 Fig.7 START and STOP conditions on the I2C-bus. 7.12.3 BIT TRANSFER One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal (see Fig.8). handbook, full pagewidth SDA SCL data line stable; data valid change of data allowed MDB008 Fig.8 Bit transfer on the I2C-bus. 7.12.4 ACKNOWLEDGE The number of data bytes transferred between the START and STOP conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the receiver generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter (see Fig.9). The device that acknowledges must pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be considered). A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. 2003 Oct 13 9 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN handbook, full pagewidth DATA OUTPUT BY SLAVE TRANSMITTER not acknowledge DATA OUTPUT BY SLAVE RECEIVER acknowledge SCL FROM MASTER TRANSMITTER S START condition clock pulse for acknowledgement MDB009 1 2 8 9 Fig.9 Acknowledge on the I2C-bus. 7.12.5 I2C-BUS PROTOCOL 7.12.5.1 Addressing Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The (slave) address of the TEA1211HN is 0001 0000 (10h). The subaddress (or word address) is 0000 0000 (00h). The TEA1211HN acts as a slave receiver only. Therefore the clock signal SCL is only an input signal. The data signal SDA is a bidirectional line, enabling the TEA1211HN to send an acknowledge. 7.12.5.2 Data The data consists of one byte, addressing the 40 voltage steps as explained in Tables 1 and 2. Table 1 Data byte BIT 7 0 BIT 6 0 BIT 5 CVLVL5 BIT 4 CVLVL4 BIT 3 CVLVL3 BIT 2 CVLVL2 BIT 2 CVLVL1 BIT 0 CVLVL0 SUBADDRESS 00h Table 2 Translation data byte to voltage level SUBADDRESS 00h NAME CVLVL SIZE (BIT) 6 STEP NUMBER MIN. (V) MIN. 0 MAX. 40 1.5 STEP (V) 0.1 MAX. (V) 5.5 2003 Oct 13 10 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 7.12.5.3 Write Cycle TEA1211HN The configuration for the different TEA1211HN write cycles is shown in Fig.10. The word address is an eight bit value that defines which register is to be accessed next. I2C-bus handbook, full pagewidth acknowledgement from slave R/W S SLAVE ADDRESS 0A acknowledgement from slave acknowledgement from slave WORD ADDRESS A DATA A P n bytes auto increment memory word address MDB010 S = START condition. P = STOP condition. Fig.10 Master transmits to slave receiver (write mode). 8 LIMITING VALUES SYMBOL PARAMETER voltage on any pin with respect to GND total internal power dissipation junction temperature ambient temperature storage temperature electrostatic discharge voltage pins LXA all other pins note 1 note 2 JEDEC Class II; note 1 JEDEC Class II; note 2 - - - - 800 200 2000 200 V V V V CONDITIONS shut-down mode operational mode MIN. -0.5 -0.5 - -40 -40 -40 MAX. +6.0 +5.5 1000 +150 +85 +125 V V mW C C C UNIT Vn Ptot Tj Tamb Tstg Vesd Notes 1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 k resistor. 2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0.75 H series inductor. 9 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE 35 UNIT K/W thermal resistance from junction mounted on dedicated PCB in to ambient free air 2003 Oct 13 11 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN 10 CHARACTERISTICS Tamb = -40 to +85 C; all voltages with respect to ground; positive currents flow into the IC; unless otherwise specified. SYMBOL Voltage levels VOUT VIN(start) VIN VIN(uvlo) VFB VOUT(wdw) Current levels Iq Ishdwn Ilim Imax quiescent current current in shut-down mode current limit deviation maximum continuous input/output current Ilim = 1 A; note 1 Tamb < 70 C no load - - -30 - 100 <1 - - - 2 +30 1.7 A A % A output voltage start voltage input voltage under voltage lockout level feedback voltage level output voltage window as percentage of VOUT PWM mode VOUT = 3.5 V; Iload < 100 mA 1.50 2.45 VIN(start) - 1.20 1.5 - 2.55 - VIN(start) - 0.15 1.25 2.0 5.50 2.65 5.50 - 1.30 3.0 V V V V V % PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Power MOSFETs; note 2 RDS(on)(N) RDS(on)(P) RDS(on)(P-up) pin-to-pin resistance NFETs VIN = 3.5 V pin-to-pin resistance PFETs VIN = 3.5 V pin-to-pin resistance P-up FET between pins LXB and OUT VOUT = 1.5 V - - - 65 65 100 85 85 135 m m m Timing fsw fsync switching frequency synchronization input frequency PWM mode 450 4.5 600 13 750 20 kHz MHz Digital levels: pins SYNC/PWM, SHDWN, SCL and SDA VIL VIH Temperature Tamb Tmax Notes 1. Current limit level is defined by the external Rlim resistor, see Chapter 11. 2. Measured at Tamb = 25 C. 3. To avoid additional supply current, it is advised to use HIGH levels not lower than VIN - 0.5 V. ambient temperature internal cut-off temperature -40 120 +25 135 +85 150 C C LOW-level input voltage HIGH-level input voltage note 3 0 - 0.4 V 0.6 x VIN - VIN + 0.3 V 2003 Oct 13 12 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 11 APPLICATION INFORMATION 11.1 Typical Li-Ion, 2- or 3-cell application with I2C-bus programming TEA1211HN handbook, full pagewidth D1 L1 10 H D2 LXA VIN = 2.55 to 5.5 V IN 1 2 31 32 3 4 10 11 LXB 14 15 21 22 24 26 25 OUT VOUT = 3.3 V TEA1211HN 23 R1 120 k FB COUT 100 F R2 75 k battery CIN 100 F 12 13 29 28 30 5 ILIM Rlim 1 k 7 27 9 16 18 20 GND SCL SYNC/ PWM SDA SHDWN MDB011 The combination of the feedback resistors R1 and R2 in parallel should be approximately 50 k. D1 and D2 are Schottky diodes The battery can be a one cell Li-Ion, two cell Alkaline or three cell NiCd/NiMH/Alkaline. If the I2C-bus interface is used for programming the output voltage, the SCL and SDA lines must be connected to a positive supply via pull-up resistors (see Section 7.12.1). If the I2C-bus interface is not used, connect pins SCL and SDA to ground. Note the VIH-level (see Chapter 10). Pins should never be left open-circuit. No external clock is applied. Fig.11 The TEA1211HN in a typical auto-up/down converter application. 2003 Oct 13 13 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN handbook, full pagewidth (1) (2) (%) (3) 100 MDB013 80 (4) (5) 60 40 20 0 1 10 100 Iload (mA) 1000 VOUT = 3.3 V. L1 = 10H, TDK SLF7032 series. (1) VIN = 2.7 V. (2) VIN = 3.3 V. (3) VIN = 3.6 V. (4) VIN = 4.2 V (5) VIN = 4.5 V. Fig.12 Efficiency as a function of load current. 2003 Oct 13 14 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter TEA1211HN handbook, full pagewidth (1) (2) (%) (3) 100 MDB012 (4) (5) 80 60 40 20 0 2.50 3.00 3.50 4.00 VIN (V) 4.50 VOUT = 3.3 V. L1 = 10H, TDK SLF7032 series. (1) IOUT = 1000 mA. (2) IOUT = 500 mA. (3) IOUT = 100 mA. (4) IOUT = 10 mA. (5) IOUT = 1 mA. Fig.13 Efficiency as a function of input voltage. 2003 Oct 13 15 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 11.2 11.2.1 Component selection INDUCTOR TEA1211HN The inductor should have a low Equivalent Series Resistance (ESR) to reduce losses and the inductor must be able to handle the peak currents without saturating. Table 3 Inductor selection information VALUE 6.8 H 10 H CAPACITORS TYPE DO3316-682 SLF7032T-100M1R4 Coilcraft TDK SUPPLIER COMPONENT L1 L1 11.2.2 For the output capacitor the ESR is critical. The output voltage ripple is determined by the product of the current through the output capacitor and its ESR. The lower the ESR, the smaller the ripple. However, an ESR less than 80 m could result in unstable operation. Table 4 Input and output capacitor selection information VALUE 100 F/10 V TYPE TPS-series 594D-series AVX Vishay/Sprague SUPPLIER COMPONENT CIN, COUT If the I2C-bus interface is used to program the output voltage, use a larger input capacitor to prevent the under voltage lockout level being triggered by large current peaks drawn from this capacitor. Table 5 Input capacitor selection information, when I2C-bus is used VALUE 220 to 470 F/10 V TYPE TPS-series 594D-series 11.2.3 SCHOTTKY DIODES AVX Vishay/Sprague SUPPLIER COMPONENT CIN (I2C-bus used) The Schottky diodes provide a lower voltage drop during the break-before-make time of the internal power FETs. It is advised to use Schottky diodes with fast recovery times. Table 6 Schottky selection information COMPONENT D1, D2 PRLL5819 TYPE Philips SUPPLIER 2003 Oct 13 16 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 11.2.4 FEEDBACK RESISTORS TEA1211HN The fixed output voltage can be set with the feedback resistors R1 and R2 (see Fig.11). Even in case I2C-bus is used for programming the output voltage, these external resistors are required for start-up. The ratio of the resistors can be V OUT R1 calculated by: ------ = ------------ - 1 , with Vref = VFB (see Chapter 10). V ref R2 The two resistors in parallel should have a value of approximately 50 k: 1 1 1 ------ + ------ --------------R1 R2 50 k 11.2.5 CURRENT LIMITER The maximum input peak current can be set by the current limiter as follows: 1250 R lim = ----------------------------- I IN(peak)(max) Remark. The output current is not limited: in down conversion, the output current will be higher than the input current, but the maximum continuous output current is not allowed to exceed 1.7 A (RMS) at 70 C. Table 7 Resistor selection information VALUE VOUT dependent Ilim dependent SMD SMD TYPE 1% 1% TOLERANCE COMPONENT R1, R2 Rlim 2003 Oct 13 17 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 12 PACKAGE OUTLINE HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm TEA1211HN SOT617-3 D B A terminal 1 index area A E A1 c detail X C e1 e 9 L 8 17 e 1/2 e b 16 vMCAB wM C y1 C y Eh 1/2 e e2 1 terminal 1 index area 32 Dh 0 DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 5.1 4.9 Dh 3.75 3.45 E (1) 5.1 4.9 Eh 3.75 3.45 25 24 X 2.5 scale e 0.5 e1 3.5 e2 3.5 L 0.5 0.3 5 mm v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT617-3 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-04-18 02-10-22 2003 Oct 13 18 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 13 SOLDERING 13.1 Introduction to soldering surface mount packages TEA1211HN with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 220 C (SnPb process) or below 245 C (Pb-free process) - for all BGA and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 235 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards 2003 Oct 13 19 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 13.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP PMFP(8) Notes not suitable not suitable(4) TEA1211HN SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable suitable not not recommended(5)(6) recommended(7) not suitable 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. 2003 Oct 13 20 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 14 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION TEA1211HN This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 16 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Oct 13 21 Philips Semiconductors Preliminary specification High efficiency auto-up/down DC/DC converter 17 PURCHASE OF PHILIPS I2C COMPONENTS TEA1211HN Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2003 Oct 13 22 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R54/02/pp23 Date of release: 2003 Oct 13 Document order number: 9397 750 12174 |
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